JPS635247Y2 - - Google Patents

Info

Publication number
JPS635247Y2
JPS635247Y2 JP1981040448U JP4044881U JPS635247Y2 JP S635247 Y2 JPS635247 Y2 JP S635247Y2 JP 1981040448 U JP1981040448 U JP 1981040448U JP 4044881 U JP4044881 U JP 4044881U JP S635247 Y2 JPS635247 Y2 JP S635247Y2
Authority
JP
Japan
Prior art keywords
semiconductor element
fixed
terminal member
semiconductor device
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981040448U
Other languages
English (en)
Japanese (ja)
Other versions
JPS57154162U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981040448U priority Critical patent/JPS635247Y2/ja
Publication of JPS57154162U publication Critical patent/JPS57154162U/ja
Application granted granted Critical
Publication of JPS635247Y2 publication Critical patent/JPS635247Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP1981040448U 1981-03-23 1981-03-23 Expired JPS635247Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981040448U JPS635247Y2 (en]) 1981-03-23 1981-03-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981040448U JPS635247Y2 (en]) 1981-03-23 1981-03-23

Publications (2)

Publication Number Publication Date
JPS57154162U JPS57154162U (en]) 1982-09-28
JPS635247Y2 true JPS635247Y2 (en]) 1988-02-12

Family

ID=29837562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981040448U Expired JPS635247Y2 (en]) 1981-03-23 1981-03-23

Country Status (1)

Country Link
JP (1) JPS635247Y2 (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4622646B2 (ja) * 2005-04-19 2011-02-02 株式会社豊田自動織機 半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5543105A (en) * 1978-09-20 1980-03-26 Hitachi Ltd Refrigerant sealing liquid
JPS5653090A (en) * 1979-10-08 1981-05-12 Dainippon Printing Co Ltd Method of setting heat-sensitive record and device thereof

Also Published As

Publication number Publication date
JPS57154162U (en]) 1982-09-28

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